Thermal Management Graphite

Product Description

As a new generation heat spreader material, thermal management graphite offers a unique combination of excellent heat stability, weight savings, high thermal conductivity, low coefficient of thermal expansion and anti-corrosion to the thermal management industry. It outperforms the traditional heat spreader materials, such as aluminum, copper and so on. It has provided valuable thermal solutions in a variety of industries and applications, including handheld communication devices, LCD, PDP, LED, CPU, MPU, automobile electronics, power amplifier and other electronics. It will not only miniaturize the electronic components, but also save the weight, lower the cost, improve the safety, optimize the energy efficiency and prolong the operating life.

Programmable properties
- Engineered thermal conductivity (240-400 W/m.K) outperforms aluminum and copper.
- The property of orientable heat spread, i.e. high thermal conductivity in a-direction (the horizontal direction), low thermal conductivity in c-direction (through-thickness direction), benefits the heat shield and eliminates the effects on the surrounding electronic components. It is about 2 to 7 times thermal conductivity between these two directions.
- With bulk density of 1.70-1.90 g/cm3, it is 30% lighter than aluminum and 80% lighter than copper. Therefore it can reduce the weight of the electronic components.
- Excellent heat stability, low coefficient of thermal expansion and performance reliable up to +400.
- Stable chemical properties, environment friendly and rustproof.

Specifications

Grade****Bulk Density( g/cc )Thermal Conductivity ( W/m.K )
a-direction c-direction

ETMP250 1.68 min. 240 - 270 150 - 180
ETMP350 1.85 min. 350 - 400 40 - 60